Effect of polyamide 6 on the morphology and electrical conductivity of carbon black-filled polypropylene composites

Carbon black (CB)-filled polypropylene (PP) with surface resistivity between 10⁶ and 10⁹ Ω sq^-1 is the ideal antistatic plastic material in the electronics and electric industry. However, a large amount of CB may have an adverse effect on the mechanical properties and processing performance of the material, thus an improved ternary system is developed. Blends of CB-filled PP and polyamide 6 (PA6) have been prepared by melt blending in order to obtain electrically conductive polymer composites with a low electrical percolation threshold based on the concept of double percolation. The morphological developments of these composites were studied by scanning electron microscopy. The results showed that CB particles were selectively dispersed in PA6 phases due to the good interaction and interfacial adhesion between CB and PA6. At the same CB loadings, the surface resistivity of PP/PA6/CB composite was smaller than that of PP/CB composite system, which indicated the better conductivity in the former composite. The increasing amount of PA6 in the composites changed the morphology from a typical sea-island morphology to a co-continuous morphology. What is more, with 8 wt% of CB and PP/PA6 phase ratio of 70/30 in which the PP and PA6 phases formed a co-continuous structure, the electrical conductivity of the composite peaked at 2.01 × 10⁵ Ω sq^-1.