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Stable molecules exist because covalent bonds hold the atoms together. The strength of a covalent bond is measured by the energy required to break it, that is, the energy necessary to separate the bonded atoms. Separating any pair of bonded atoms requires energy — the stronger a bond, the greater the energy required to break it.
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Low-Temperature Copper Bonding Strategy with Graphene Interlayer.

Haozhe Wang1, Wei Sun Leong1, Fengtian Hu2

  • 1Department of Electrical Engineering and Computer Science , Massachusetts Institute of Technology , Cambridge , Massachusetts 02139 , United States.

ACS Nano
|January 26, 2018
PubMed
Summary
This summary is machine-generated.

This study introduces a novel graphene interlayer for lead-free copper (Cu) bonding, enabling reliable Sn-Cu joints at a low 150°C bonding temperature. The graphene interlayer effectively suppresses intermetallic compound growth, enhancing joint reliability and longevity.

Keywords:
copper interconnectscopper nanocone arraygrapheneintegrated circuit packagingtin solder

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Surface Engineering

Background:

  • Lead-free copper (Cu) bonding faces challenges with high temperatures and intermetallic compound (IMC) growth.
  • Reliable and low-temperature bonding methods are crucial for advanced electronic packaging.

Purpose of the Study:

  • To develop a low-temperature, highly reliable Cu bonding strategy using graphene as an interlayer.
  • To investigate the effect of graphene on intermetallic compound formation and joint reliability.

Main Methods:

  • Fabrication of a nanoscale graphene/Cu composite on Cu substrates.
  • Thermocompression bonding at temperatures as low as 150°C.
  • Scanning Electron Microscopy (SEM) and shear strength analysis for material characterization and reliability testing.

Main Results:

  • Achieved reliable Sn-Cu joints at 150°C using the graphene/Cu composite.
  • Demonstrated that nanoscale Sn features, replicated from Cu nanocones, facilitate lower-temperature distribution.
  • Graphene interlayer significantly retarded IMC growth and maintained high bonding yield after 96 hours of aging.

Conclusions:

  • The graphene-based Cu bonding strategy offers a reliable, cost-effective, and environmentally friendly solution.
  • This approach overcomes limitations of traditional lead-free bonding, paving the way for industrial applications.