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New strategies for producing defect free SiGe strained nanolayers
Thomas David1, Jean-Noël Aqua2, Kailang Liu1,2
1CNRS, Aix Marseille University, UMR 7334, Inst Mat Microelect Nanosci Prov, F-13397, Marseille, France.
Scientific Reports
|February 15, 2018
Summary
Strain engineering improves electronic devices but faces growth instability. Pre-straining substrates effectively inhibits this instability and dislocation nucleation in SiGe heteroepitaxy.
Area of Science:
- Materials Science
- Solid State Physics
- Nanotechnology
Background:
- Strain engineering is crucial for enhancing electronic device properties.
- Asarro Tiller Grinfeld instability and dislocation nucleation limit strain engineering.
- Existing methods include stretchable nanomembranes and lateral stressors.
Purpose of the Study:
- Investigate the impact of substrate softness and pre-strain on growth instability and dislocation nucleation.
- Evaluate the effectiveness of compliant and pre-strained substrates in SiGe heteroepitaxy.
Main Methods:
- Theoretical modeling of substrate effects on growth instability.
- Experimental validation using Silicon On Insulator (SOI) and porous silicon substrates.
- Heteroepitaxy of Silicon-Germanium (SiGe) on various substrates.
Main Results:
- Soft substrates enhance instability growth rate in specific conditions but not for SiGe due to normalized layer thickness.
- Tensile pre-strained substrates significantly inhibit both growth instability and misfit dislocation nucleation.
- Observed inhibition during SiGe heteroepitaxy on pre-strained porous silicon.
Conclusions:
- Substrate softness has limited impact on SiGe heteroepitaxy instability under tested conditions.
- Tensile pre-straining is a highly effective strategy to suppress detrimental growth instabilities and dislocations.
- Findings offer insights for advanced strain engineering in semiconductor device fabrication.
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