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Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process.

Bong Hoon Kim1,2, Jungyup Lee2, Sang Min Won2

  • 1Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States.

ACS Nano
|April 12, 2018
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Summary
This summary is machine-generated.

Deterministic assembly enables the creation of complex 3D electronic devices using silicon nanomembranes (Si NMs). This technology integrates high-performance electronics into diverse 3D structures, including stretchable systems.

Keywords:
mechanical bucklingsilicon diodesilicon transistorthree-dimensional electronics

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electrical Engineering

Background:

  • Deterministic assembly techniques allow 2D to 3D structural transformations.
  • Integration of planar thin film materials into 3D layouts is a key challenge.

Purpose of the Study:

  • To demonstrate the direct embedding of high-performance electronic devices into 3D constructs using silicon nanomembranes (Si NMs).
  • To explore the versatility of this approach across various 3D architectures and device types.

Main Methods:

  • Utilized silicon nanomembranes (Si NMs) as active materials for electronic components.
  • Fabricated diverse 3D architectures including bridges, coils, and chiral structures.
  • Embedded n-channel Si NM MOSFETs (nMOS), Si NM diodes, and p-channel silicon MOSFETs (pMOS).

Main Results:

  • Successfully integrated functional electronic devices into complex 3D structures.
  • Demonstrated the fabrication of interconnected bridges, coils, and chiral architectures with embedded electronics.
  • Showcased the adaptability of the platform for stretchable and deformable electronic systems.

Conclusions:

  • Deterministic assembly provides a powerful platform for creating 3D electronic devices with embedded Si NMs.
  • The methodology is applicable to a wide range of materials and device technologies, including energy storage, photovoltaics, and optoelectronics.