Microstructure and Thermal Conductivity of Carbon Nanotube Reinforced Cu Composites

Microstructure and thermal conductivity (TC) of carbon nanotubes reinforced Cu (CNT-Cu) composites have been studied. When CNTs were coated with nano Cu by electroless plating, the TC of CNT-Cu composites showed a noticeable improvement and increased with CNT contents. When 1.0 vol% CNTs was added, the TC of CNT-Cu composites increased to 420.4 W/(m · K), 30% higher than that of monolithic Cu (323.1 W/(m · K)). According to the measured TC of CNT-Cu composites, the interfacial thermal resistance of CNT-Cu composites was calculated as 3.0 × 10⁻⁹ m² K/W which was lower than the reported values of CNTs reinforced polymer matrix composites and ceramic matrix composites. Microstructures showed that CNTs modified with nano Cu were homogeneously dispersed and embedded in the Cu matrix, indicating that there was strong bonding between CNTs and Cu. The homogeneously dispersed CNTs and reduction of interfacial thermal resistance resulted in the improvement of thermal conductivity of CNT-Cu composites. Therefore, the prepared CNT-Cu composites are promising materials for thermal management applications.