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Remote heat dissipation in atom-sized contacts
Makusu Tsutsui1, Takanori Morikawa2, Kazumichi Yokota
1The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka, 567-0047, Japan. tsutsui@sanken.osaka-u.ac.jp.
Scientific Reports
|May 20, 2018
Summary
Heat dissipation in nanoelectronics is critical. This study reveals remote heat dissipation in gold nanocontacts, finding microleads effectively manage temperature rise, ensuring atomic contact stability.
Area of Science:
- Nanoscale heat transfer
- Solid-state physics
- Materials science
Background:
- Heat dissipation is a major challenge in nanoelectronics, particularly in ballistic systems where hot carriers transfer kinetic energy to phonon baths.
- Understanding remote heat dissipation mechanisms is crucial for the stability and performance of atomic and molecular electronic devices.
Purpose of the Study:
- To investigate a physical mechanism of remote heat dissipation in current-carrying ballistic systems.
- To analyze the role of this heat dissipation on the stability of atomic contacts.
- To explore practical design strategies for heat dissipation management in nanoelectronic devices.
Main Methods:
- Utilized a nano-fabricated thermocouple to directly measure self-heating in a mechanically-configurable gold (Au) junction.
- Characterized electron-hole asymmetry in Au nanocontacts by observing heat dissipation patterns.
- Measured the lifetime of single-atom chains to assess the impact of heat dissipation on contact stability.
Main Results:
- Observed more pronounced heat dissipation at the current downstream, indicating electron-hole asymmetry in Au nanocontacts.
- Found that microleads act as effective heat spreaders, moderating temperature rises to a few Kelvins above ambient.
- Demonstrated a minor influence of heat dissipation on atomic contact stability under microwatt power conditions.
Conclusions:
- The study elucidates a remote heat dissipation mechanism in gold nanocontacts.
- Microleads are effective in mitigating temperature increases, thereby preserving the stability of atomic contacts.
- These findings offer valuable insights for designing robust atomic and molecular electronic devices with efficient thermal management.
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