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Effects of reducing light-curing time of a high-power LED device on shear bond strength of brackets
Layene Figueiredo Almeida1, Lidia Parsekian Martins1, Renato Parsekian Martins2,3
1Program of Orthodontics, Universidade Estadual Paulista, Araraquara, Brazil.
Purpose:
To assess the effects of reducing the curing time of a high-power light-emitting diode (LED) unit (Valo, Ultradent, South Jordan, UT, USA) on shear bond strength (SBS) of metal brackets and on the amount of adhesive remnant of two orthodontic composites.
Methods:
Eighty human premolars were divided into four groups (G1-4) according to curing time and composite: G1 (Transbond XT, 6 s), G2 (Opal Bond MV, 6 s), G3 (Transbond XT, 3 s), and G4 (Opal Bond MV, 3 s). Twenty-four hours after bonding, brackets were subject to a SBS test performed with a universal testing machine. Enamel surface was analyzed by SEM and the amount of adhesive remnant was assessed by the Image J software area calculation tool. Two-way analysis of variance was used for statistical analysis of SBS data, while Friedman and Mann-Whitney post hoc tests were used to analyze data on the amount of adhesive remnant.
Results:
Time and composite significantly affected SBS (p < 0.001). The 6 s curing showed a higher SBS value (21.56 MPa) in comparison to 3 s curing (15.79 MPa). Transbond XT composite showed a significantly higher SBS value (21.06 MPa) compared to Opal Bond MV (16.29 MPa). After the SBS test, Opal Bond MV showed a significantly greater amount of composite adhered to enamel (p < 0.001).
Conclusion:
Reducing exposure time from 6 to 3 s significantly decreased mean values of SBS, even with the use of a high-power LED unit. Reduction in time did not affect the amount of adhesive remnant.
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