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Updated: Feb 3, 2026

3D Scanning Technology Bridging Microcircuits and Macroscale Brain Images in 3D Novel Embedding Overlapping Protocol
Published on: May 12, 2019
Ni Chen1, Chao Zuo2, Edmund Y Lam3
1Department of Electrical and Computer Engineering, Seoul National University, Gwanak-Gu Gwanakro 1, Seoul 08826, Korea. chenni@snu.ac.kr.
This study reviews three-dimensional (3D) imaging techniques, focusing on depth measurements. It explores connections between ray-based and wavefront-based 3D imaging methods to improve applications.
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