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Related Concept Videos

Hydrogen Bonds00:26

Hydrogen Bonds

133.3K
Hydrogen bonds are weak attractions between atoms that have formed other chemical bonds. One of these atoms is electronegative, like oxygen, and has a partial negative charge. The other is a hydrogen atom that has bonded with another electronegative atom and has a partial positive charge.
Hydrogen Bonds Control the World!
Because hydrogen has very weak electronegativity when it binds with a strongly electronegative atom, such as oxygen or nitrogen, electrons in the bond are unequally shared....
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Hydrogen Bonds01:04

Hydrogen Bonds

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A hydrogen bond is formed when a weakly positive hydrogen atom already bonded to one electronegative atom (for example, the oxygen in the water molecule) is attracted to another electronegative atom from another polar molecule, such as water (H2O), hydrogen fluoride (HF), or ammonia (NH3). The huge electronegativity difference between the H atom (2.1) and the atom to which it is bonded (4.0 for an F atom, 3.5 for an O atom, or 3.0 for an N atom), combined with the very small size of an H atom...
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Valence Bond Theory02:45

Valence Bond Theory

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Overview of Valence Bond Theory
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Covalent Bonds01:29

Covalent Bonds

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Overview
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Bond Energies and Bond Lengths02:49

Bond Energies and Bond Lengths

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Stable molecules exist because covalent bonds hold the atoms together. The strength of a covalent bond is measured by the energy required to break it, that is, the energy necessary to separate the bonded atoms. Separating any pair of bonded atoms requires energy — the stronger a bond, the greater the energy required to break it.
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Bonding in Metals02:32

Bonding in Metals

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Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”. 
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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
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Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames.

Koki Tanaka1, Hideki Hirano2, Masafumi Kumano3

  • 1Department of Robotics, Tohoku University, 6-6-01, Aza Aoba, Aramaki Aoba-ku, Sendai 980-8579, Japan. koki.tanaka@tel.com.

Micromachines
|November 15, 2018
PubMed
Summary

A new atomic hydrogen treatment enables low-temperature copper-copper vacuum sealing for wafer-level packaging. This novel method achieves high-quality vacuum seals at 300°C, reducing oxidation and improving bonding strength.

Keywords:
Cu thermos-compression bondingatomic hydrogenhot wirenano-grainwafer bondingwafer-level vacuum packaging

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Area of Science:

  • Materials Science
  • Surface Science
  • Semiconductor Manufacturing

Background:

  • Wafer-level vacuum packaging is crucial for advanced semiconductor devices.
  • Copper-copper (Cu-Cu) bonding is a key technology for high-density interconnects.
  • Conventional Cu-Cu bonding requires high temperatures, limiting its application for heat-sensitive components.

Purpose of the Study:

  • To develop a novel surface activation technology for low-temperature Cu-Cu bonding.
  • To investigate the use of hot-wire-generated atomic hydrogen for copper oxide reduction.
  • To enable vacuum sealing at reduced temperatures for wafer-level packaging.

Main Methods:

  • Utilized hot-wire-generated atomic hydrogen for surface activation of Cu.
  • Employed a remote-type hot-wire tool to minimize substrate overheating.
  • Analyzed the effect of atomic hydrogen pre-treatment on Cu native oxide reduction and re-oxidation suppression.
  • Evaluated vacuum sealing temperature, yield, pressure, bonding shear strength, and leak rate.

Main Results:

  • Achieved vacuum sealing at 300°C, a 50°C reduction compared to conventional methods (350°C).
  • Atomic hydrogen pre-treatment effectively reduced Cu native oxide and suppressed re-oxidation during storage.
  • Bonding shear strength reached 100 MPa with a vacuum sealing yield of 90% and cavity pressure of 5 kPa.
  • Demonstrated a leak rate below 10-14 Pa m³ s-1, suitable for practical applications.

Conclusions:

  • Hot-wire-generated atomic hydrogen treatment is an effective method for low-temperature Cu-Cu bonding in wafer-level vacuum packaging.
  • This technology enables high-performance hermetic sealing at reduced temperatures, preserving device integrity.
  • The developed process offers a viable alternative for advanced packaging solutions requiring low thermal budget.