Koki Tanaka

2PUBLICATIONS
0CO-AUTHORS
Chemical and thermal processes in energy and combustionColloid and surface chemistry
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Publications (2)

|Nov 15, 2018
Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames.

Koki Tanaka, Hideki Hirano, Masafumi Kumano

|Nov 09, 2018
Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding.

Koki Tanaka, Wei-Shan Wang, Mario Baum

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