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Imaging and Quantification of the Area of Fast-Moving Microbubbles Using a High-Speed Camera and Image Analysis
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Dipping Process Characteristics Based on Image Processing of Pictures Captured by High-speed Cameras
Junhui Li1, Yang Xia1, Wei Wang1
1School of Mechanical and Electronical Engineering and State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha, 410083 People's Republic of China.
Nano-Micro Letters
|November 23, 2018
Summary
Optimizing flux glue dipping involves controlling viscosity and speed. Lower viscosity and speeds above 0.2 cm/s minimize defects, ensuring consistent flux quantity for reliable microelectronic assembly.
Area of Science:
- Materials Science
- Microelectronic Fabrication
- Fluid Dynamics
Background:
- Flux application is critical in microelectronic assembly.
- Controlling flux quantity and uniformity is essential for reliable soldering.
- Understanding the dynamics of flux dipping is key to process optimization.
Purpose of the Study:
- To investigate the impact of dipping parameters on flux quantity and micelle formation.
- To determine optimal conditions for minimizing defects during the flux dipping process.
- To establish relationships between viscosity, speed, acceleration, and dipping time with flux deposition.
Main Methods:
- High-speed camera system for recording the dipping process.
- Image processing using Otsu's method for analyzing flux distribution.
- Controlled dipping bed system to manipulate acceleration time, speed, and dipping time.
- Real-time monitoring of dipping flux quantity.
Main Results:
- Low-viscosity flux effectively eliminates micelles; speeds ≥0.2 cm/s prevent micelle hiding.
- Reducing flux viscosity from 4,500 to 3,500 mPa·s decreases flux quantity by ~100 square pixels.
- For 3,500 mPa·s flux, quantity initially increases with speed, then decreases after 0.8 cm/s.
- Stable dipping flux quantity is achieved in 80-90 ms at speeds of 1.6–4.0 cm/s.
- Flux quantity increases with acceleration time but decreases with acceleration rate.
- Flux quantity increases with dipping time, reaching saturation around 55 ms.
Conclusions:
- Flux viscosity and dipping speed are critical parameters for controlling flux quantity and minimizing defects.
- Optimal dipping parameters can be identified to ensure consistent and uniform flux deposition.
- The study provides a quantitative understanding of flux dipping dynamics for improved microelectronic assembly processes.
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