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Step-Double-Zone-JTE for SiC Devices with Increased Tolerance to JTE Dose and Surface Charges
Yifei Huang1, Ying Wang2, Xiaofei Kuang3
1Key Laboratory of RF Circuits and Systems, Ministry of Education, Hangzhou Dianzi University, Hangzhou 310018, China. 162040160@hdu.edu.cn.
Abstract:
In this paper, an edge termination structure, referred to as step-double-zone junction termination extension (Step-DZ-JTE), is proposed. Step-DZ-JTE further improves the distribution of the electric field (EF) by its own step shape. Step-DZ-JTE and other termination structures are investigated for comparison using numerical simulations. Step-DZ-JTE greatly reduces the sensitivity of breakdown voltage (BV) and surface charges (SC). For a 30-μm thick epi-layer, the optimized Step-DZ-JTE shows 90% of the theoretical BV with a wide tolerance of 12.2 × 1012 cm-2 to the JTE dose and 85% of the theoretical BV with an improved tolerance of 3.7 × 1012 cm-2 to the positive SC are obtained. Furthermore, when combined with the field plate technique, the performance of the Step-DZ-JTE is further improved.
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