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Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using

Jing-Ye Juang1, Chia-Ling Lu2, Yu-Jin Li3

  • 1Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan. david.mse03g@g2.nctu.edu.tw.

Materials (Basel, Switzerland)
|November 28, 2018
PubMed

Keywords:
Cu-to-Cu direct bondinggrain growthnanotwinned Cushear strengthsurface diffusion

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