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Updated: Jan 30, 2026
14:01
Making Record-efficiency SnS Solar Cells by Thermal Evaporation and Atomic Layer Deposition
Published on: May 22, 2015
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Particle atomic layer deposition
1Chemical and Biological Engineering, University of Colorado, Boulder, CO 80309-0596 USA.
Summary
Atomic layer deposition (ALD) functionalizes particles with conformal nanothick films. This technique precisely controls film thickness for diverse applications, offering a path toward commercial products.
Area of Science:
- Materials Science
- Nanotechnology
- Chemical Engineering
Background:
- Atomic layer deposition (ALD) enables conformal coating of particles.
- Controlling film thickness at the nanoscale is crucial for advanced materials.
Purpose of the Study:
- To review the history and advancements in particle ALD.
- To discuss methods, applications, and future prospects of particle ALD.
Main Methods:
- Review of agitated reactor processing for particle ALD.
- Exploration of atomic layer deposition (ALD) and molecular layer deposition (MLD).
- Analysis of coating techniques for inorganic/polymer particles, nanoparticles, and nanotubes.
Main Results:
- Particle ALD achieves highly conformal nanothick films on complex surfaces.
- Precise control over film thickness (angstroms to nanometers) is demonstrated.
- Continuous or semi-continuous films can be produced.
Conclusions:
- Particle ALD is a versatile technique for particle functionalization.
- The review highlights diverse applications and commercial potential.
- Future developments are expected to drive near-term product realization.
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