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Related Concept Videos

Body Temperature01:25

Body Temperature

4.3K
The body's temperature, measured in degrees, is determined by the balance between heat production and dissipation to the surrounding environment. For instance, if exercising vigorously, the body will produce more heat, causing sweat and dissipating that heat. Despite extreme environmental conditions and physical exertion, the human temperature-control system maintains a constant core body temperature (the temperature of deep tissues, which are the tissues located beneath the skin and other...
4.3K
Body Temperature01:07

Body Temperature

1.4K
Body temperature reflects the equilibrium between heat production and heat loss within the body. Most heat is generated by metabolically active tissues, particularly the liver, heart, brain, kidneys, and endocrine organs. At rest, skeletal muscles contribute 20–30% of total heat production, but during vigorous exercise, this can increase up to 30–40 times.
The average body temperature is approximately 37°C (98.6°F) and typically ranges from 36.1–37.2°C...
1.4K
Effects of Temperature on Free Energy02:11

Effects of Temperature on Free Energy

28.2K
The spontaneity of a process depends upon the temperature of the system. Phase transitions, for example, will proceed spontaneously in one direction or the other depending upon the temperature of the substance in question. Likewise, some chemical reactions can also exhibit temperature-dependent spontaneities. To illustrate this concept, the equation relating free energy change to the enthalpy and entropy changes for the process is considered:
28.2K
Factors Affecting Body Temperature01:28

Factors Affecting Body Temperature

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As a nurse, it is vital to understand the factors affecting body temperature to monitor variations and effectively evaluate deviations from regular.
Factors may  include:
8.8K
Increased Body Temperature01:25

Increased Body Temperature

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A body temperature above  38°C  (100.4 °F) is known as fever or pyrexia, and a person with fever is termed 'febrile.' Typically, the hypothalamus, a part of the brain that acts as the body's thermostat, regulates body temperature through a thermoregulatory setpoint. It receives signals from cold and warm thermal receptors throughout the body and adjusts the body's temperature accordingly. Fever occurs when this hypothalamic setpoint is altered, usually in...
7.5K
Decreased Body Temperature01:29

Decreased Body Temperature

1.1K
A decreased body temperature can occur in patients with hypothermia and frostbite. Heat loss with extended cold exposure overpowers the body's ability to create heat, resulting in hypothermia. Core temperature readings help classify hypothermia. Mild hypothermia is temperatures between 32 °C (89.6 °F) and 35°C (95 °F) and is caused by impaired thermoregulation. Moderate hypothermia is temperatures between 28 C (82.4 °F) and 32 °C (89.6 °F) caused by...
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Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology
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Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor

Jinseok Choi1, Gab Soo Choi2, Sung Jin An3

  • 1Department of Advanced Materials Science and Engineering, Kumoh National Institute of technology, 61 Daehak-ro, Gumi-si, Gyeongsangbuk-do, 39177, Korea.

Scientific Reports
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A novel Ag/Sn/Ag die attach process offers a low-cost, eco-friendly solution for high-temperature semiconductor applications. This method provides superior performance and reliability compared to traditional materials.

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Area of Science:

  • Materials Science
  • Semiconductor Manufacturing

Background:

  • High-temperature semiconductor applications require reliable die attach materials.
  • Conventional lead (Pb)-based and gold (Au)-based die attach systems present environmental concerns and high costs.

Purpose of the Study:

  • To develop a low-cost, eco-friendly die attach process for high-temperature semiconductor devices.
  • To evaluate the performance of a novel Ag/Sn/Ag sandwich structure as a die attach material.

Main Methods:

  • Development of a die attach process utilizing an Ag/Sn/Ag sandwich structure as backside metal.
  • Implementation of a low-temperature bonding process (235°C) with a rapid bonding time (20 ms).
  • Comparative analysis against conventional Au-12Ge and Pb-10Sn backside metals.

Main Results:

  • The Ag/Sn/Ag structure enables a low-temperature, rapid die bonding process suitable for mass production.
  • Achieved a high remelting temperature exceeding 400°C.
  • Demonstrated superior properties compared to traditional Au-12Ge and Pb-10Sn materials.

Conclusions:

  • The Ag/Sn/Ag sandwich structure is a viable and advantageous alternative for high-temperature die attach.
  • This process supports the mass production of reliable silicon (Si) devices for demanding applications.
  • Further reliability tests confirmed the material's suitability for high-temperature environments.