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Accurate 3D Shape, Displacement and Deformation Measurement Using a Smartphone.

Liping Yu1, Ran Tao2, Gilles Lubineau3

  • 1COHMAS Laboratory, Physical Sciences and Engineering Division (PSE), King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia. liping.yu@kaust.edu.sa.

Sensors (Basel, Switzerland)
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Summary
This summary is machine-generated.

A new smartphone-based stereo-digital image correlation system offers cost-effective 3D shape and deformation measurements. This portable system, using mirrors and a smartphone, shows potential for resource-limited settings despite thermal-induced errors.

Keywords:
optical attachmentsmartphonestereo-digital image correlation

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Area of Science:

  • Experimental Mechanics
  • Optical Measurement Techniques
  • Instrumentation

Background:

  • Stereo-digital image correlation (DIC) is vital for 3D measurements but requires expensive equipment.
  • Existing DIC setups are bulky and complex, limiting use in resource-limited or field settings.

Purpose of the Study:

  • To develop a cost-effective, ultra-portable smartphone-based stereo-DIC system.
  • To explore the capabilities and limitations of this novel configuration for 3D measurements.

Main Methods:

  • Utilized a smartphone with a custom optical attachment featuring four planar mirrors to simulate stereovision.
  • Validated the system through 3D shape, in-plane/out-of-plane displacement, and strain measurements on composite specimens.
  • Investigated and explained thermal-induced errors caused by smartphone heating.

Main Results:

  • The system accurately measured 3D shape and displacement after addressing thermal errors via preheating.
  • Strain measurements on a composite specimen showed comparable accuracy to traditional strain gauges.
  • Successfully demonstrated 3D deformation tracking on a deflating ball.

Conclusions:

  • The smartphone-based stereo-DIC system provides a viable, low-cost alternative for 3D deformation analysis.
  • Its portability and reduced cost enhance accessibility for scientific research and field applications.
  • Further research can optimize the system to mitigate thermal effects for even greater accuracy.