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Updated: Jan 29, 2026

Soft Lithographic Functionalization and Patterning Oxide-free Silicon and Germanium
Published on: December 16, 2011
Simulation of Field Assisted Sintering of Silicon Germanium Alloys
Anastasiia Tukmakova1, Anna Novotelnova2, Kseniia Samusevich3
1Faculty of Cryogenic Engineering, ITMO University, St. Petersburg 197101, Russia. astukmakova@corp.ifmo.ru.
Abstract:
We report a numerical study of the field assisted sintering of silicon germanium alloys by a finite element method, which takes into account contact resistances, thermal expansion and the thermoelectric effect. The distribution of electrical and thermal fields was analyzed numerically, based on the experimental data collected from spark plasma sintering (SPS) apparatus. The thermoelectric properties of Si-Ge used within the simulation were considered as the function of density and the sintering temperature. Quantitative estimation of the temperature distribution during the sintering pointed to a significant, up to 60 °C, temperature difference within the specimen volume for the case of the sintering temperature at 1150 °C.
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