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Universal scaling of polygonal desiccation crack patterns
Xiaolei Ma1, Janna Lowensohn1, Justin C Burton1
1Department of Physics, Emory University, Atlanta, Georgia 30322, USA.
Physical Review. E
|February 21, 2019
Summary
Polygonal desiccation cracks in thin films share universal physics across scales. A universal power law, A_p=αh^{4/3}, links crack area to film thickness, unifying crack pattern understanding.
Area of Science:
- Materials Science
- Geophysics
- Fluid Dynamics
Background:
- Polygonal desiccation crack patterns are common but their underlying physics across scales is debated.
- Existing theories on crack formation in thin films yield contradictory predictions regarding length scales.
- The relationship between film thickness and crack characteristics remains poorly understood.
Purpose of the Study:
- To experimentally investigate the physics of polygonal desiccation cracks in drying particle suspensions.
- To determine if crack patterns across different length scales share common physical principles.
- To develop a unified framework for understanding multiscale crack formation.
Main Methods:
- Experimental investigation of drying suspensions of micron-sized particles.
- Systematic variation of film thickness, boundary adhesion, packing fraction, and solvent composition.
- Analysis of crack patterns and their characteristic areas using a universal power law.
Main Results:
- Polygonal cracks form in most systems above a critical film thickness.
- Multiscale crack patterns were observed in cornstarch-water mixtures due to distinct desiccation mechanisms (capillary shrinkage and particle deswelling).
- A universal power law, A_p=αh^{4/3}, describes the characteristic crack area (A_p) as a function of film thickness (h).
Conclusions:
- The study provides a robust framework for understanding multiscale polygonal crack patterns.
- The findings link crack formation physics to material properties, unifying observations from microscopic to geologic scales.
- The universal power law offers a predictive tool for crack behavior in various natural and engineered systems.
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