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Mixed Rigid and Flexible Component Design for High-Performance Polyimide Films.

Xiaohui Yu1, Weihua Liang2, Jianhua Cao3

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New polyimides (PIs) were developed to match copper's thermal expansion. These advanced PIs offer enhanced thermal stability and mechanical properties, ideal for flexible electronics.

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copper clad laminatelinear coefficient of thermal expansion (CTE)polyimide filmstructure and properties

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Area of Science:

  • Materials Science
  • Polymer Chemistry

Background:

  • Polyimides (PIs) are crucial in electronics but often lack thermal expansion matching with copper.
  • Developing PIs with coefficients of thermal expansion (CTE) similar to copper is essential for advanced electronic applications.

Purpose of the Study:

  • To synthesize and characterize polyimides (PIs) with a coefficient of thermal expansion (CTE) closely matched to that of copper.
  • To optimize the physical and thermal properties of PIs by adjusting the ratio of rigid and flexible monomers.

Main Methods:

  • Sequential copolymerization of 5,4'-diamino-2-phenyl benzimidazole (DAPBI), 4,4'-diaminodiphenyl ether (ODA), and 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA).
  • Blade coating of polyamic acid onto copper foil followed by thermal imidization.
  • Characterization of thermal stability, dimensional stability, mechanical properties, and CTE.

Main Results:

  • Polyimide properties were tuned by varying DAPBI and ODA content, enhancing thermal and mechanical performance with increased DAPBI.
  • PI-80 achieved a glass transition temperature of 370 °C, tensile strength of 210 MPa, and a CTE of approximately 19 ppm/K, matching copper.
  • Copper/PI laminates exhibited high dimensional stability, minimal curling, and a peel strength of 6.4 N/cm.

Conclusions:

  • The developed polyimides demonstrate excellent comprehensive performance and CTE matching with copper.
  • These materials show significant potential for applications as electronic films in flexible displays and flexible printed circuit boards.
  • Structural rationalization supports the observed remarkable properties of the synthesized polyimides.