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Extraction of Plant-based Capsules for Microencapsulation Applications
Published on: November 9, 2016
Novel Dual-Component Microencapsulated Hydrophobic Amine and Microencapsulated Isocyanate Used for Self-Healing
Maolian Guo1, Wei Li2,3, Na Han4
1State Key Laboratory of Separation Membranes and Membrane Processes, Tianjin Key Laboratory of Advanced Fibers and Energy Storage, School of Material Science and Engineering, Tianjin Polytechnic University, Tianjin 300387, China. guomaoliansx@163.com.
Abstract:
Dual component microencapsulated hydrophobic amine and microencapsulated isocyanate were designed and fabricated for self-healing anti-corrosion coating. In this system, novel hydrophobic polyaspartic acid ester (PAE) and isophorone diisocyanate (IPDI) were microencapsulated respectively with melamine-formaldehyde (MF) as shell via in situ polymerization. To reduce the reaction activity between shell-forming MF prepolymer and PAE, another self-healing agent tung oil (TO) was dissolved in PAE and subsequently employed as core material. With field-emission scanning electron microscopy (FE-SEM) and optical microscopy (OM), the resultant microencapsulated IPDI with diameter of 2⁻5 μm showed a spherical shape and smooth surface. More importantly, both the morphology and microstructure of microencapsulated PAE enhanced significantly after addition of TO. Fourier transform infrared spectra (FTIR) analysis confirmed the molecular structure of chemical structure of the microcapsules. Thermal gravimetric analysis (TGA) indicated that both kinds of microcapsules exhibit excellent thermal resistance with the protection of MF shell. Furthermore, the self-healing epoxy coating system containing microencapsulated IPDI and microencapsulated PAE/TO was prepared and investigated. From the micrographs of true color confocal microscope (TCCM), the self-healing coating containing dual-component microcapsules showed excellent self-repairing performance compared to single microencapsulated IPDI system, and the optimal content of dual-component microcapsules in epoxy coating was 20 wt % approximately.
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