A Throughput Study for Channel Bonding in IEEE 802.11ac Networks.

Mun-Suk Kim1, Tanguy Ropitault1, Nada Golmie1

  • 1National Institute of Standards and Technology, Gaithersburg, MD 20899 USA.

IEEE Communications Letters : a Publication of the IEEE Communications Society
|May 17, 2019
PubMed
Summary

This study presents an improved analytical model for IEEE 802.11ac channel bonding throughput, accounting for collisions in both saturated and non-saturated traffic conditions. The model offers more accurate performance estimations for wireless networks.

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