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Updated: Jan 23, 2026
14:01
Making Record-efficiency SnS Solar Cells by Thermal Evaporation and Atomic Layer Deposition
Published on: May 22, 2015
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New development of atomic layer deposition: processes, methods and applications
Peter Ozaveshe Oviroh1, Rokhsareh Akbarzadeh1, Dongqing Pan2
1Mechanical Engineering Science Department, Faculty of Engineering and the Built Environment, University of Johannesburg, Johannesburg, South Africa.
Science and Technology of Advanced Materials
|June 6, 2019
Summary
Atomic Layer Deposition (ALD) offers uniform, controllable thin-film growth for electronics and beyond. This review covers ALD
Area of Science:
- Materials Science
- Nanotechnology
- Chemical Engineering
Background:
- Atomic Layer Deposition (ALD) is a key technique for depositing ultra-thin films.
- ALD enables uniform, conformal coatings with precise thickness control, even on complex 3D structures.
- Its applications span microelectronics, energy storage, catalysis, and medical fields.
Purpose of the Study:
- To review advancements in Atomic Layer Deposition (ALD) methodologies.
- To compare ALD with other film deposition techniques.
- To provide an outlook on the future potential of ALD.
Main Methods:
- Review of experimental approaches and influencing factors in ALD.
- Exploration of computational methods like molecular dynamics and computational fluid dynamics for ALD optimization.
- Analysis of simulation techniques to predict and refine ALD processes.
Main Results:
- ALD facilitates the synthesis of novel functional materials.
- Optimized ALD processes reduce costs, energy consumption, and environmental impact.
- ALD has demonstrated significant impact across various technological domains.
Conclusions:
- ALD is a versatile and rapidly advancing deposition technique.
- Computational and experimental methods are crucial for optimizing ALD.
- ALD holds substantial promise for future technological innovations.
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