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Related Concept Videos

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The shape of a small drop of liquid can be considered spherical, neglecting the effect of gravity. This drop can further be considered as two equal hemispherical drops put together due to surface tension. The forces acting on the spherical drop are due to the pressure of the liquid inside the drop, the pressure due to air outside the drop, and the force due to the surface tension acting on the two hemispherical drops.
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Group 1 elements are soft and shiny metallic solids. They are malleable, ductile, and good conductors of heat and electricity. The melting points of the alkali metals are unusually low for metals and decrease going down the group, while the density increases going down the group with the exception of potassium (Table 1).
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Related Experiment Video

Updated: Jan 23, 2026

Preparation of Monodomain Liquid Crystal Elastomers and Liquid Crystal Elastomer Nanocomposites
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Plasma-Induced Bubble Microjet Metallization of Elastomer.

Keita Ichikawa1, Natsumi Basaki2, Yu Yamashita3

  • 1Department of Engineering, Kyushu University, Fukuoka 819-0395, Japan. 3TE18662G@s.kyushu-u.ac.jp.

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|June 20, 2019
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Summary

This study introduces a novel plasma-induced microbubble wiring technique for flexible materials. This method enables rapid, economical, and robust metallic adhesion without surface treatment, paving the way for advanced microfabrication.

Keywords:
adhesionlatex rubbernanoparticlesnickelwiring

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Area of Science:

  • Materials Science
  • Surface Engineering
  • Microfabrication

Background:

  • Advancements in flexible and advanced materials necessitate innovative wiring solutions.
  • Conventional wiring methods often require complex surface treatments, limiting their application.
  • There is a growing demand for simple, cost-effective, and robust methods for fabricating electrical circuits on diverse substrates.

Purpose of the Study:

  • To develop and investigate a new wiring technology utilizing plasma-induced microbubbles for elastomers.
  • To demonstrate the feasibility of wiring without pre-surface treatment.
  • To achieve precise, robust, and economical metallic adhesion for electrical conductivity.

Main Methods:

  • Development of a wiring technique based on plasma-induced microbubbles.
  • Application of the method to a latex rubber substrate without any surface modification.
  • Adhesion of nickel nanoparticles to form conductive lines.

Main Results:

  • Successful metallic nanoparticle adhesion on an elastomer substrate without pre-treatment.
  • Achieved a wiring resolution of 500 micrometers.
  • Demonstrated electrical conductivity of the fabricated lines, indicating robust metallic adhesion.

Conclusions:

  • The plasma-induced microbubble method offers an innovative approach for fabricating electrical circuits on flexible materials.
  • The technique eliminates the need for complicated pre-surface treatments, simplifying the fabrication process.
  • This method provides a precise, robust, and economical solution for microfabrication, with potential applications in advanced electronics.