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A Multi-Method Simulation Toolbox to Study Performance and Variability of Nanowire FETs.
Natalia Seoane1, Daniel Nagy2, Guillermo Indalecio2
1Centro Singular de Investigación en Tecnoloxías da Información, University of Santiago de Compostela, 15782 Santiago de Compostela, Spain. natalia.seoane@usc.es.
A new 3D simulation toolbox accurately models semiconductor devices. It shows a 10 nm gate-all-around transistor outperforms FinFETs in on/off current but has higher variability.
Area of Science:
- Computational Physics
- Semiconductor Device Modeling
- Materials Science
Background:
- Accurate simulation of advanced semiconductor devices is crucial for performance and scalability.
- Understanding variability sources is key to optimizing nanoscale transistor design.
- Existing models may not fully capture the complex interplay of factors in modern transistors.
Purpose of the Study:
- To introduce a novel 3D multi-method simulation toolbox for characterizing semiconductor devices.
- To evaluate the performance, scalability, and variability of a 10 nm gate-all-around (GAA) field-effect transistor (FET).
- To identify critical regions sensitive to specific variability sources.
Main Methods:
- Development of an in-house 3D multi-method semi-classical/classical simulation toolbox.
- Benchmark simulation of a 10 nm gate length Si GAA FET.
- Analysis of device performance metrics including on-current (I ON), off-current (I OFF), and I ON / I OFF ratio.
- Quantification of threshold voltage standard deviation due to multiple variability sources.
- Generation of fluctuation sensitivity maps to pinpoint critical device regions.
Main Results:
- The simulated 10 nm GAA FET achieved an I OFF of 0.03 μA/μm and an I ON of 1770 μA/μm, yielding an I ON / I OFF ratio of 6.63 × 10^4.
- This ratio is 27% higher than a comparable 10.7 nm Si FinFET, with a subthreshold slope (SS) of 71 mV/dec.
- The threshold voltage standard deviation was 55.5 mV, significantly higher than the FinFET's 30 mV, attributed to line-edge roughness, metal grain granularity, and random dopants.
- Sensitivity maps revealed that the on-current is highly susceptible to line-edge roughness near the source-gate junction and metal grains near the gate-source proximity.
Conclusions:
- The developed 3D toolbox effectively characterizes advanced semiconductor devices, highlighting performance and variability trade-offs.
- The 10 nm GAA FET demonstrates superior on/off current ratios but increased sensitivity to variability compared to FinFETs.
- Identifying critical regions for variability mitigation is essential for future nanoscale transistor development.
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