Electrical Reliability and Bending Test Methodologies of Metal Electrode on Flexible Substrate

Byoung-Joo Kim1, Young-Bae Park1, Young-Chang Joo2

  • 1Materials Research Centre for Energy and Clean Technology, Department of Materials Science and Engineering, Andong National University, Andong 36729, Republic of Korea.

Summary

Mechanical reliability is crucial for flexible electronics. This study compares four bending test methods, revealing different electrical resistance changes and fatigue damage patterns in copper films, aiding in developing more robust devices.

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