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Related Concept Videos

Theory of Metallic Conduction01:17

Theory of Metallic Conduction

1.7K
The conduction of free electrons inside a conductor is best described by quantum mechanics. However, a classical model makes predictions close to the results of quantum mechanics. It is called the theory of metallic conduction.
In this theory, Newton's second law of motion is used to determine the acceleration of an electron in the presence of an applied electric field. Then, its velocity is expressed via this acceleration.
An electron moves through the crystal, containing positive ions,...
1.7K
Bonding in Metals02:32

Bonding in Metals

52.1K
Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”. 
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Alkali Metals03:06

Alkali Metals

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Group 1 elements are soft and shiny metallic solids. They are malleable, ductile, and good conductors of heat and electricity. The melting points of the alkali metals are unusually low for metals and decrease going down the group, while the density increases going down the group with the exception of potassium (Table 1).
Table 1: Properties of the alkali metals
24.2K
Properties of Transition Metals02:58

Properties of Transition Metals

29.6K
Transition metals are defined as those elements that have partially filled d orbitals. As shown in Figure 1, the d-block elements in groups 3–12 are transition elements. The f-block elements, also called inner transition metals (the lanthanides and actinides), also meet this criterion because the d orbital is partially occupied before the f orbitals.
29.6K
Metallic Solids02:37

Metallic Solids

20.5K
Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....
20.5K
Metal-Ligand Bonds02:51

Metal-Ligand Bonds

24.0K
The hemoglobin in the blood, the chlorophyll in green plants, vitamin B-12, and the catalyst used in the manufacture of polyethylene all contain coordination compounds. Ions of the metals, especially the transition metals, are likely to form complexes.
In these complexes, transition metals form coordinate covalent bonds, a kind of Lewis acid-base interaction in which both of the electrons in the bond are contributed by a donor (Lewis base) to an electron acceptor (Lewis acid). The Lewis acid in...
24.0K

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Metal Corrosion and the Efficiency of Corrosion Inhibitors in Less Conductive Media
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Rewritable, Printable Conducting Liquid Metal Hydrogel.

Jung-Eun Park, Han Sol Kang, Jonghyek Baek

    ACS Nano
    |August 14, 2019
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    Summary

    Researchers developed novel liquid metal hydrogels for rewritable, printable electronic circuits. This breakthrough enables on-demand circuit creation with a unique writing-erasing mechanism, paving the way for advanced flexible electronics.

    Keywords:
    conducting EGaIn/polymerelectrical interconnectionsfriction-induced circuit writingliquid metal hydrogelsprintable circuitsrewritable electric circuitswater-assisted erasing

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    Area of Science:

    • Materials Science
    • Nanotechnology
    • Flexible Electronics

    Background:

    • High-performance printable circuits are crucial for flexible electronics.
    • Current liquid metal circuits are often manufactured on demand.
    • Need for rewritable and printable solutions.

    Purpose of the Study:

    • To demonstrate liquid metal-based hydrogels for rewritable, printable electrical circuits.
    • To develop a system with a writing-erasing mechanism for on-demand circuit fabrication.
    • To explore the potential for flexible electronic applications.

    Main Methods:

    • Fabrication of liquid metal hydrogels using eutectic gallium-indium (EGaIn) particles in poly(ethylene glycol) diacrylate (PEGDA).
    • Utilizing sedimentation-induced composites with vertically phase-segregated EGaIn particles.
    • Employing surface friction pen printing for circuit creation and water-driven swelling for erasure.

    Main Results:

    • Demonstrated rewritable and printable electrical circuits based on liquid metal hydrogels.
    • Achieved a dramatic change in electrical resistance (∼1 Ω to ∼107 Ω) over 20 writing-erasing cycles.
    • Showcased mechanically flexible, rewritable conductors suitable for display applications.

    Conclusions:

    • Liquid metal hydrogels offer a viable platform for rewritable, printable electronic circuits.
    • The friction-responsive mechanism allows for on-demand circuit fabrication and erasure.
    • This technology holds promise for future flexible electronic devices, particularly displays.