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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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Structure and properties of Sn-Cu lead-free solders in electronics packaging

Meng Zhao1, Liang Zhang1, Zhi-Quan Liu2

  • 1School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, China.

Science and Technology of Advanced Materials
|September 7, 2019
PubMed

Keywords:
100 Materials103 Composites106 Metallic materials40 Optical, magnetic and electronic device materials503 TEM, STEM, SEMIMCSn-Cumechanical propertiesmicrostructures

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