Zhi-Quan Liu

9PUBLICATIONS
10CO-AUTHORS
Molecular imaging (incl. electron microscopy and neutron diffraction)Circuits and systemsTransition metal chemistryPowder and particle technologyPhotonic and electro-optical devices, sensors and systems (excl. communications)
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Publications (9)

|Apr 24, 2025
Revealing the Mechanical Properties and Fracture Mechanism of Ag Paste Sintered Solder by Two Different Preparation Methods.

Jialong Liang, Hao-Kun Yang, Xingming Huang

|Nov 27, 2024
Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding.

Wenjie Li, Zhe Li, Fang-Yuan Zeng

|Sep 14, 2024
Bonding Behavior and Quality of Pressureless Ag Sintering on (111)-Oriented Nanotwinned Cu Substrate in Ambient Air.

Xingming Huang, Wei He, Jialong Liang

|Jun 27, 2024
Research Overview on the Electromigration Reliability of SnBi Solder Alloy.

Wenjie Li, Liwei Guo, Dan Li

|Jul 14, 2023
Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging.

Ke-Xin Chen, Li-Yin Gao, Zhe Li

|Jan 28, 2020
Focused ion beam preparation of microbeams for in situ mechanical analysis of electroplated nanotwinned copper with probe type indenters.

Stuart Robertson, Scott Doak, Fu-Long Sun

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Frequent Collaborators

2 joint publications

Li-Yin Gao

2 joint publications

Hao-Kun Yang

1 joint publications

Liang Zhang

1 joint publications

Nan Jiang