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Li-Yin Gao

4PUBLICATIONS

3CO-AUTHORS

Composite and hybrid materialsMolecular imaging (incl. electron microscopy and neutron diffraction)Circuits and systemsElectrical energy transmission, networks and systems

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Publications (4)

Sort by Publication Date:

|Jun 02, 2025

Review of Cu-Cu direct bonding technology in advanced packaging.

Ze-Hao Zhao, Li-Yin Gao, Zhi-Quan Liu

|Apr 24, 2025

Revealing the Mechanical Properties and Fracture Mechanism of Ag Paste Sintered Solder by Two Different Preparation Methods.

Jialong Liang, Hao-Kun Yang, Xingming Huang

|Jul 14, 2023

Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging.

Ke-Xin Chen, Li-Yin Gao, Zhe Li

|Oct 03, 2022

Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL).

Jing Huang, Li-Yin Gao, Zhen-Jia Peng

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Frequent Collaborators

2 joint publications

Zhi-Quan Liu

1 joint publications

Ke-Xin Chen

1 joint publications

Hao-Kun Yang

Frequent Collaborators

2 joint publications

Zhi-Quan Liu

1 joint publications

Ke-Xin Chen

1 joint publications

Hao-Kun Yang

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