Liang Zhang
2PUBLICATIONS
2CO-AUTHORS

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Publications (2)
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|Nov 12, 2020
Review of microstructure and properties of low temperature lead-free solder in electronic packaging.Kai-Kai Xu, Liang Zhang, Li-Li Gao
|Sep 19, 2019
Reliability issues of lead-free solder joints in electronic devices.Nan Jiang, Liang Zhang, Zhi-Quan Liu
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