Liang Zhang

2PUBLICATIONS
2CO-AUTHORS
Metals and alloy materialsPhotonic and electro-optical devices, sensors and systems (excl. communications)
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Publications (2)

|Nov 12, 2020
Review of microstructure and properties of low temperature lead-free solder in electronic packaging.

Kai-Kai Xu, Liang Zhang, Li-Li Gao

|Sep 19, 2019
Reliability issues of lead-free solder joints in electronic devices.

Nan Jiang, Liang Zhang, Zhi-Quan Liu

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