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Thermal Measurement Techniques in Analytical Microfluidic Devices
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A widely adaptable analytical method for thermal analysis of flexible electronics with complex heat source structures

Yafei Yin1, Min Li1, Wei Yuan2

  • 1Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, People's Republic of China.

Proceedings. Mathematical, Physical, and Engineering Sciences
|September 20, 2019
PubMed

Keywords:
flexible electronicsheat conductionserpentine structuresthermal analysis

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