Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

Thermal expansion and Thermal stress: Problem Solving01:27

Thermal expansion and Thermal stress: Problem Solving

2.1K
San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55...
2.1K
Thermal Stress01:09

Thermal Stress

3.3K
If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...
3.3K
Mechanism of heat transfer01:19

Mechanism of heat transfer

1.9K
Understanding heat transfer mechanisms is essential for understanding how our bodies maintain balance in different environmental conditions. When the environment is thermoneutral, the body is in a state of balance, neither using nor releasing energy to maintain its core temperature. However, when the environment is not thermoneutral, the body employs four heat transfer mechanisms to maintain homeostasis: conduction, convection, evaporation, and radiation. These mechanisms facilitate heat...
1.9K
Mechanisms of Heat Transfer II01:20

Mechanisms of Heat Transfer II

4.2K
In convection, thermal energy is carried by the large-scale flow of matter. Ocean currents and large-scale atmospheric circulation, which result from the buoyancy of warm air and water, transfer hot air from the tropics toward the poles and cold air from the poles toward the tropics. The Earth’s rotation interacts with those flows, causing the observed eastward flow of air in the temperate zones. Convection dominates heat transfer by air, and the amount of available space for the airflow...
4.2K
Mechanisms of Heat Transfer01:14

Mechanisms of Heat Transfer

1.6K
Heat transfer between the human body and its environment occurs through four main mechanisms: conduction, convection, radiation, and evaporation.
Conduction, accounting for approximately 3% of body heat loss at rest, is the process of exchanging heat between molecules of two materials in direct contact. This can result in both heat loss and gain. For instance, when the body is submerged in water, which conducts heat 20 times more effectively than air, it can either lose or gain significant...
1.6K
Mechanisms of Heat Transfer I01:14

Mechanisms of Heat Transfer I

6.0K
Just as interesting as the effects of heat transfer on a system are the methods by which the heat transfer occur. Whenever there is a temperature difference, heat transfer occurs. It may occur rapidly, such as through a cooking pan, or slowly, such as through the walls of a picnic ice box. So many processes involve heat transfer that it is hard to imagine a situation where no heat transfer occurs. Yet, every heat transfer takes place by only three methods: conduction, convection, and radiation.
6.0K

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Deformation-Induced Electromagnetic Reconfigurable Square Ring Kirigami Metasurfaces.

Micromachines·2025
Same author

Skin Comfort Sensation with Mechanical Stimulus from Electronic Skin.

Materials (Basel, Switzerland)·2024
Same author

Intelligent wearable olfactory interface for latency-free mixed reality and fast olfactory enhancement.

Nature communications·2024
Same author

A Temperature Prediction Model for Flexible Electronic Devices Based on GA-BP Neural Network and Experimental Verification.

Micromachines·2024
Same author

A Wearable Flexible Acceleration Sensor for Monitoring Human Motion.

Biosensors·2022
Same author

Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices.

Micromachines·2021

Related Experiment Video

Updated: Jan 19, 2026

Thermal Measurement Techniques in Analytical Microfluidic Devices
08:29

Thermal Measurement Techniques in Analytical Microfluidic Devices

Published on: June 3, 2015

10.1K

A widely adaptable analytical method for thermal analysis of flexible electronics with complex heat source

Yafei Yin1, Min Li1, Wei Yuan2

  • 1Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, People's Republic of China.

Proceedings. Mathematical, Physical, and Engineering Sciences
|September 20, 2019
PubMed
Summary

Thermal management is crucial for exothermic flexible electronics. A new analytical method accurately predicts temperature and heat flow, aiding future device design.

Keywords:
flexible electronicsheat conductionserpentine structuresthermal analysis

More Related Videos

Identification and Quantification of Decomposition Mechanisms in Lithium-Ion Batteries; Input to Heat Flow Simulation for Modeling Thermal Runaway
11:25

Identification and Quantification of Decomposition Mechanisms in Lithium-Ion Batteries; Input to Heat Flow Simulation for Modeling Thermal Runaway

Published on: March 7, 2022

5.2K
Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation
11:11

Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation

Published on: May 2, 2016

11.6K

Related Experiment Videos

Last Updated: Jan 19, 2026

Thermal Measurement Techniques in Analytical Microfluidic Devices
08:29

Thermal Measurement Techniques in Analytical Microfluidic Devices

Published on: June 3, 2015

10.1K
Identification and Quantification of Decomposition Mechanisms in Lithium-Ion Batteries; Input to Heat Flow Simulation for Modeling Thermal Runaway
11:25

Identification and Quantification of Decomposition Mechanisms in Lithium-Ion Batteries; Input to Heat Flow Simulation for Modeling Thermal Runaway

Published on: March 7, 2022

5.2K
Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation
11:11

Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation

Published on: May 2, 2016

11.6K

Area of Science:

  • Flexible electronics
  • Bio-integrated systems
  • Thermal management

Background:

  • Flexible electronics offer significant potential, particularly in bio-integrated applications.
  • Effective thermal management is critical for exothermic flexible electronics, whether to dissipate or utilize excess heat.
  • Complex heat source geometries and layouts in flexible electronics pose challenges for thermal analysis.

Purpose of the Study:

  • To develop and validate a widely adaptable analytical method for investigating the thermal properties of exothermic flexible electronics.
  • To analyze thermal fields in flexible electronics with complex heat source shapes or array layouts.
  • To provide a tool for accurate temperature and heat flow control in flexible electronic devices.

Main Methods:

  • An analytical method based on integral calculus along complex curve source regions was employed.
  • The analytical method was validated using finite-element analysis and experimental data.
  • Investigation focused on thermal properties of exothermic flexible electronic components.

Main Results:

  • The analytical model accurately predicts the thermal field distribution.
  • The method allows for precise control over temperature and heat flow.
  • Validation confirmed the model's reliability for complex thermal scenarios.

Conclusions:

  • The developed analytical method is effective for thermal analysis of exothermic flexible electronics.
  • Accurate thermal prediction aids in the design and fabrication of advanced flexible electronic devices.
  • This research contributes to overcoming thermal management challenges in bio-integrated flexible electronics.