Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Related Concept Videos

Mechanism of heat transfer

Mechanism of heat transfer

Understanding heat transfer mechanisms is essential for understanding how our bodies maintain balance in different environmental conditions. When the environment is thermoneutral, the body is in a state of balance, neither using nor releasing energy to maintain its core temperature. However, when the environment is not thermoneutral, the body employs four heat transfer mechanisms to maintain homeostasis: conduction, convection, evaporation, and radiation. These mechanisms facilitate heat...

Mechanisms of Heat Transfer II

Mechanisms of Heat Transfer II

In convection, thermal energy is carried by the large-scale flow of matter. Ocean currents and large-scale atmospheric circulation, which result from the buoyancy of warm air and water, transfer hot air from the tropics toward the poles and cold air from the poles toward the tropics. The Earth’s rotation interacts with those flows, causing the observed eastward flow of air in the temperate zones. Convection dominates heat transfer by air, and the amount of available space for the airflow...

Mechanisms of Heat Transfer

Mechanisms of Heat Transfer

Heat transfer between the human body and its environment occurs through four main mechanisms: conduction, convection, radiation, and evaporation.
Conduction, accounting for approximately 3% of body heat loss at rest, is the process of exchanging heat between molecules of two materials in direct contact. This can result in both heat loss and gain. For instance, when the body is submerged in water, which conducts heat 20 times more effectively than air, it can either lose or gain significant...

Mechanisms of Heat Transfer I

Mechanisms of Heat Transfer I

Just as interesting as the effects of heat transfer on a system are the methods by which the heat transfer occur. Whenever there is a temperature difference, heat transfer occurs. It may occur rapidly, such as through a cooking pan, or slowly, such as through the walls of a picnic ice box. So many processes involve heat transfer that it is hard to imagine a situation where no heat transfer occurs. Yet, every heat transfer takes place by only three methods: conduction, convection, and radiation.

Heat Flow and Specific Heat

Heat Flow and Specific Heat

Heat is a type of energy transfer that is caused by a temperature difference, and it can change the temperature of an object. Since heat is a form of energy, its SI unit is the joule (J). Another common unit of energy often used for heat is the calorie (cal), which is defined as the energy needed to change the temperature of 1 g of water by 1 °C, specifically between 14.5 °C and 15.5 °C, since the energy needed shows a slight temperature dependence. Another commonly used unit is...

Thermal Stress

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same author

Theoretical quantitative model and clinical outcome predictions of conductive cardiac patches for electrophysiological treatments.

Nature biomedical engineering·2026

Same author

Exploring Back Muscle Activities in Chronic Low Back Pain Patients Using a Large-Area Stretchable Electrode Array With Full-Back Coverage.

Advanced healthcare materials·2026

Same author

Multisensory electronic skin with decoupled pressure-temperature-sensing capabilities for similar object recognition.

Proceedings of the National Academy of Sciences of the United States of America·2025

Same author

Mechanically Tunable Electromagnetic Metamaterials Based on Chains of Tension-rotation Coupling Units with Exceptional Reconfiguration Capability.

Small methods·2025

Same author

Accurate and Noninvasive Dysphagia Assessment via a Soft High-Density sEMG Electrode Array Conformal to the Submental and Infrahyoid Muscles.

Advanced science (Weinheim, Baden-Wurttemberg, Germany)·2025

Same author

Deformation-Induced Electromagnetic Reconfigurable Square Ring Kirigami Metasurfaces.

Micromachines·2025

Search research articles

Related Experiment Video

Updated: Oct 16, 2025

Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation

Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation

Published on: May 2, 2016

Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices.

Yanan Yu¹, Yafei Yin¹, Yuhang Li¹

¹Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China.

|October 23, 2021

Summary

Active heat dissipation using embedded flow channels enhances electronic device longevity. Optimizing fluid temperature, flow velocity, and channel density improves thermal management in electronics.

Keywords:

active heat dissipation flexible electronics flow channel thermal analysis

More Related Videos

Thermal Measurement Techniques in Analytical Microfluidic Devices

Thermal Measurement Techniques in Analytical Microfluidic Devices

Published on: June 3, 2015

Uncoupling Coriolis Force and Rotating Buoyancy Effects on Full-Field Heat Transfer Properties of a Rotating Channel

Uncoupling Coriolis Force and Rotating Buoyancy Effects on Full-Field Heat Transfer Properties of a Rotating Channel

Published on: October 5, 2018

Related Experiment Videos

Last Updated: Oct 16, 2025

Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation

Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation

Published on: May 2, 2016

Thermal Measurement Techniques in Analytical Microfluidic Devices

Thermal Measurement Techniques in Analytical Microfluidic Devices

Published on: June 3, 2015

Uncoupling Coriolis Force and Rotating Buoyancy Effects on Full-Field Heat Transfer Properties of a Rotating Channel

Uncoupling Coriolis Force and Rotating Buoyancy Effects on Full-Field Heat Transfer Properties of a Rotating Channel

Published on: October 5, 2018

Area of Science:

Electronics thermal management
Heat transfer in flexible electronics
Computational fluid dynamics

Background:

Heat generation is a critical factor limiting electronic device performance and lifespan.
Flexible electronics pose unique thermal challenges due to low thermal conductivity substrates.
Active heat dissipation with integrated flow channels offers a promising solution.

Purpose of the Study:

To develop and validate a theoretical model for analyzing active heat dissipation in designs with embedded flow channels.
To investigate the impact of fluid temperature, flow velocity, and channel spacing on thermal performance.
To provide design guidelines for optimizing active heat dissipation systems.

Main Methods:

Development of a theoretical model using the method of separation of variables.
Validation of the theoretical model through finite element analysis (FEA) and experimental testing.
Systematic investigation of thermal behavior under varying operational parameters.

Main Results:

Decreasing fluid temperature significantly enhances heat dissipation efficiency.
Increasing fluid flow velocity leads to improved thermal performance.
Higher channel density (closer spacing) positively impacts heat dissipation capabilities.

Conclusions:

The developed model accurately predicts thermal behavior in active heat dissipation systems.
Optimizing fluid parameters and channel geometry is crucial for effective thermal management.
This research guides the design of more reliable and longer-lasting electronic products through enhanced cooling.