Related Experiment Video
Updated: Jan 19, 2026

11:09
Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
10.7K
Highly Bendable and Durable Waterproof Paper for Ultra-High Electromagnetic Interference Shielding.
Fang Ren1, Han Guo1, Zheng-Zheng Guo1
1The Faculty of Printing and Packaging Engineering, Xi'an University of Technology, Xi'an 710048, China.
Polymers
|September 25, 2019
Summary
A novel electromagnetic interference (EMI) shielding paper combines silver nanowires and ceramic for excellent water repellency and conductivity. This flexible material offers high EMI shielding effectiveness, suitable for harsh environments.
Area of Science:
- Materials Science
- Nanotechnology
- Surface Chemistry
Background:
- Electromagnetic interference (EMI) poses challenges in electronic devices.
- Developing flexible, water-repellent EMI shielding materials is crucial for advanced applications.
Purpose of the Study:
- To create a multifunctional paper with high EMI shielding, water repellency, and mechanical flexibility.
- To investigate the structure-property relationships of silver nanowire-cellulose composites.
Main Methods:
- Dip-coating preparation of cellulose paper with silver nanowires (AgNWs) and hydrophobic ceramic.
- Scanning electron microscopy (SEM) for structural analysis.
- Electrical conductivity and EMI shielding effectiveness (EMI SE) measurements.
Main Results:
- Dense, interconnected AgNW network on cellulose fibers achieved at low AgNW density (0.13 mg/cm²).
- High in-plane conductivity of 33.69 S/cm.
- Exceptional EMI SE of 46 dB (X band) and specific EMI SE of 271.2 dB mm⁻¹.
- Maintained high EMI SE and water contact angle > 140° after mechanical stress.
Conclusions:
- The developed hydrophobic AgNW/cellulose composite paper exhibits excellent EMI shielding and waterproof properties.
- Its mechanical flexibility and durability make it suitable for demanding applications.
- Potential applications include conductive component packaging and EMI shielding elements in harsh conditions.

