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Updated: Jan 5, 2026

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Published on: June 14, 2019
Wetting transitions in droplet drying on soft materials
Julia Gerber1, Tobias Lendenmann1, Hadi Eghlidi1
1Laboratory of Thermodynamics in Emerging Technologies, Department of Mechanical and Process Engineering, ETH Zurich, Sonneggstrasse 3, CH-8092, Zurich, Switzerland.
Researchers discovered a new wetting transition in droplet drying on compliant materials. This phenomenon, driven by substrate deformation at high speeds, impacts liquid removal and surface design in industries.
Area of Science:
- Physics
- Materials Science
- Fluid Dynamics
Background:
- Droplet interactions with compliant materials are crucial in manufacturing, chemical, and garment industries.
- Previous research shows substrate deformations can influence droplet drying and spreading dynamics.
- The combined effects of transient wetting and substrate deformation on drying are not fully understood.
Purpose of the Study:
- To investigate the complex interplay between transient wetting phenomena and substrate deformation during droplet drying.
- To identify and characterize any novel wetting transitions occurring under dynamic drying conditions.
- To understand the mechanisms governing liquid removal on compliant substrates.
Main Methods:
- Utilized 4D confocal reference-free traction force microscopy (cTFM) for high-resolution quantification.
- Measured transient displacement and stress fields at the droplet-substrate interface.
- Analyzed the dynamics of the receding contact line during droplet drying.
Main Results:
- Observed a previously undocumented wetting transition above a critical receding contact line speed.
- Revealed high and asymmetric local substrate deformations.
- Demonstrated contact line pinning and rate-dependent wettability on viscoelastic solids.
Conclusions:
- The study reveals a new wetting transition governed by drying speed and substrate compliance.
- High-speed drying induces significant substrate deformation, affecting droplet behavior.
- Findings are significant for liquid removal processes and surface design on compliant materials.
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