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Published on: July 10, 2018
Current-Induced Changes of Surface Morphology in Printed Ag Thin Wires
Quan Sun1, Yebo Lu2, Chengli Tang3
1College of Mechanical and Electrical Engineering, Jiaxing University, 118 Jiahang Road, Jiaxing 314001, China. sunquan0501@163.com.
Electromigration, not thermal effects, alters printed silver thin wire surfaces. Joule heating accelerates this process, offering insights for enhancing electronic device reliability.
Area of Science:
- Materials Science
- Electrical Engineering
- Surface Science
Background:
- Printed silver (Ag) thin wires are crucial components in flexible electronic devices.
- Understanding surface morphology changes under electrical stress is vital for device longevity.
Purpose of the Study:
- To investigate current-induced surface morphology changes in printed Ag thin wires.
- To elucidate the underlying mechanisms and contributing factors.
- To propose guidelines for improving electrical reliability.
Main Methods:
- Current stressing tests were performed on printed Ag thin wires on flexible substrates.
- Numerical simulations based on the atomic flux divergence method were employed.
- Experimental results were compared with simulation outcomes.
Main Results:
- Electromigration was identified as the primary cause of surface morphology changes.
- The contribution of thermal migration was found to be negligible.
- Joule heating significantly accelerated the electromigration process.
- Simulations showed good agreement with experimental data.
Conclusions:
- Electromigration is the dominant mechanism altering the surface morphology of printed Ag thin wires.
- Joule heating plays a critical role in accelerating electromigration.
- Proposed guidelines can optimize current density for improved electrical reliability and extended lifetime of printed Ag thin wires in flexible electronics.
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