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Published on: November 28, 2016
Doping effects on the geometric and electronic structure of tin clusters
Martin Gleditzsch1, Marc Jäger, Lukáš F Pašteka
1Technische Universität Darmstadt, Eduard-Zintl-Institut, Alarich-Weiss-Straße 8, 64287 Darmstadt, Germany. gleditzsch@cluster.pc.chemie.tu-darmstadt.de.
Copper-doped tin clusters form endohedral complexes, confirmed by molecular beam electric deflection experiments and simulations. Theoretical analysis reveals electron transfer from tin to copper, creating ionic structures.
Area of Science:
- Physical Chemistry
- Materials Science
- Computational Chemistry
Background:
- Investigating the structure and electronic properties of doped metal clusters is crucial for understanding their chemical behavior.
- Tin clusters doped with transition metals offer unique electronic and geometric characteristics.
Purpose of the Study:
- To experimentally and theoretically investigate the structure of neutral single copper-doped tin clusters (SnNCu, N=9-16).
- To determine the nature of bonding and electron transfer within these endohedral complexes.
Main Methods:
- Molecular beam electric deflection experiments were conducted at various cryogenic nozzle temperatures.
- Classical rotational dynamic simulations were employed, utilizing globally optimized structures from genetic algorithms and density functional theory.
Main Results:
- Experimental cluster beam profiles of SnNCu (N=9-16) were obtained and compared with simulations.
- The formation of endohedral complexes with geometries similar to manganese- and gold-doped tin was confirmed.
- Theoretical methods predicted ionic structures (Cuδ-@SnNδ+) with significant electron transfer from the tin cage to the copper dopant.
Conclusions:
- Copper-doped tin clusters form stable endohedral structures.
- Electron transfer from the tin cage to the copper dopant dictates the ionic nature of these complexes.
- The findings provide insights into the behavior of transition metal tetrel complexes.
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