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A curious observation of phenomena occurring during lapping/polishing processes
Yue Yang1, Haonan Li2, Zhirong Liao3
1Department of Mechanical, Materials and Manufacturing Engineering, Faculty of Science and Engineering, The University of Nottingham Ningbo China, Ningbo 315100, People's Republic of China.
Proceedings. Mathematical, Physical, and Engineering Sciences
|November 19, 2019
Summary
Polishing processes involve complex
Area of Science:
- Manufacturing Engineering
- Materials Science
- Tribology
Background:
- Previous studies modeled polishing kinematics as idealized planetary motion.
- This idealization overlooks real-world workpiece constraints and movements.
Purpose of the Study:
- To identify and model the unobserved 'parasitic' movement in polishing.
- To quantify the impact of this parasitic movement on surface roughness.
- To improve predictions of workpiece surface morphology.
Main Methods:
- Developed a model for parasitic movement in polishing.
- Utilized a motion capture system to track sample and tool movements.
- Validated models against experimental observations.
Main Results:
- Demonstrated that polishing kinematics deviate from idealized planetary motion.
- Quantified the effect of parasitic movement on workpiece surface roughness.
- Showed improved surface morphology prediction by including parasitic movement.
Conclusions:
- Parasitic movement significantly affects polishing outcomes.
- The developed modeling framework enhances prediction accuracy.
- Consideration of tool-workpiece compliance is crucial for manufacturing process prediction.
