Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization

A Cedeño López1, V Grimaudo2, A Riedo3

  • 1Department of Chemistry and Biochemistry, Interfacial Electrochemistry Group , University of Bern , Freiestrasse 3 , 3012 Bern , Switzerland.

Analytical Chemistry
|December 21, 2019
PubMed