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Published on: August 12, 2013
Field-Induced Carrier Localization Transition in Dielectric Polymers
Thomas M Linker1, Subodh Tiwari1, Hiroyuki Kumazoe2
1Collaboratory for Advanced Computing and Simulations , University of Southern California , Los Angeles , California 90089-0242 , United States.
Researchers studied hot carrier dynamics in polyethylene under high electric fields. A critical transition was observed, leading to bond breaking and providing a new method for predicting dielectric breakdown in polymers.
Area of Science:
- Materials Science
- Computational Chemistry
- Solid State Physics
Background:
- Organic polymers offer advantages like flexibility and cost-effectiveness for dielectric applications.
- Their use is limited by dielectric breakdown under high electric fields, a phenomenon lacking mechanistic understanding in polymers.
- Existing models for dielectric breakdown, often based on avalanche processes, do not fully explain polymer behavior.
Purpose of the Study:
- To investigate the mechanistic understanding of dielectric breakdown in polymers.
- To explore the impact of high electric fields on hot carrier dynamics and chemical damage in polyethylene.
- To develop a predictive method for screening polymers with high dielectric breakdown fields.
Main Methods:
- Utilized nonadiabatic quantum molecular dynamics simulations.
- Systematically studied the effects of varying electric fields on polyethylene.
- Analyzed hot carrier dynamics, electronic state localization, and resulting chemical damage.
Main Results:
- High electric fields induce localized electronic states at the polymer surface.
- A critical transition in electronic states was identified near the intrinsic breakdown field.
- Strong polaronic coupling, C-H vibrational resonance, and C-C bond breaking were observed, indicating severe chemical damage.
Conclusions:
- The identified polaronic localization transition is a key factor in polymer dielectric breakdown.
- This transition provides a mechanistic understanding and a potential predictive tool for polymer dielectric strength.
- The findings enable computational screening of dielectric polymers for enhanced breakdown resistance.
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