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Updated: Dec 30, 2025
Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Investigation of Synthesis Mechanism, Optimal Hot-Pressing Conditions, and Curing Behavior of Sucrose and Ammonium
Zhongyuan Zhao1, Shunsuke Sakai2, Di Wu1
1College of Furnishings and Industrial Design, Nanjing Forestry University, Nanjing 210037, China.
Abstract:
In this study, a further investigation was carried out on the synthesis mechanism, optimal manufacturing conditions, and curing behavior of a sucrose-ammonium dihydrogen phosphate (SADP) adhesive. The results of 13C nuclear magnetic resonance (NMR) spectroscopy confirmed that SADP was composed of 5-hydroxymethylfurfural (5-HMF), deoxyfructosazine (DOF), amino compounds, Schiff base, monosaccharides, and oligosaccharide. The optimal hot-pressing conditions were a hot-pressing temperature of 170 °C, a hot-pressing time of 7 min, and a spread rate of 120 g/m2. The wet shear strength of plywood bonded at optimal manufacturing conditions met the requirements of China National Standard (GB/T 9846-2015). Thermal analysis and insoluble mass proportion measurements showed that the main curing behavior of the SADP adhesive occurred at curing temperatures higher than 145 °C, and more than 50% insoluble mass was formed when the heating time was longer than 5 min. Fourier-transform infrared spectroscopy (FT-IR) indicated that cross-linking of the cured adhesive was promoted by prolonging the heating time. In addition, pyrolysis gas chromatography and mass spectrometry (Py-GC/MS) confirmed that the cured SADP adhesive was composed of furan and nitrogen-containing compounds.
