A multi-dimensional and level-by-level assembly strategy for constructing flexible and sandwich-type

Caichao Wan1, Yue Jiao2, Xianjun Li1

  • 1College of Materials Science and Engineering, Central South University of Forestry and Technology, Changsha 410004, PR China. wancaichaojy@163.com wuyq0506@126.com.

Nanoscale
|January 25, 2020
PubMed
Summary

Developing advanced electromagnetic interference (EMI) shielding materials is crucial for portable electronics. This study introduces novel, lightweight, and flexible DLG/Ni NPs/CF composites offering exceptional EMI shielding performance.