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Ultrasonic Implant Localization for Wireless Power Transfer: Active Uplink and Harmonic Backscatter
Max L Wang1, Ting Chia Chang1, Amin Arbabian1
1Department of Electrical Engineering, Stanford University, Stanford, CA, USA.
Accurate ultrasound localization of implantable devices is crucial for efficient power transfer. This study demonstrates sub-millimeter accuracy using three channels, significantly improving power delivery by over 20x.
Area of Science:
- Biomedical Engineering
- Ultrasound Technology
- Implantable Devices
Background:
- Efficient power transfer to implantable devices relies on precise ultrasonic beamforming.
- Implant location shifts can rapidly degrade power transfer efficiency.
- Ultrasound localization offers a method for tracking implants to maintain optimal energy transmission.
Purpose of the Study:
- To present a framework for calculating ultrasound localization accuracy for implantable devices.
- To compare harmonic backscatter and active uplink methods for implant localization.
- To demonstrate improved ultrasonic power transfer using accurate localization.
Main Methods:
- Developed a framework to assess localization accuracy using a linear array probe.
- Investigated harmonic backscatter and active uplink approaches for implant communication.
- Characterized localization accuracy with a minimal three-channel receiver setup.
Main Results:
- Achieved sub-millimeter localization accuracy, with standard deviation two orders of magnitude smaller than the beamwidth.
- Harmonic backscatter demonstrated comparable localization performance to active uplink.
- Beamforming based on measured implant location increased power transfer efficiency over 20-fold.
Conclusions:
- Sub-millimeter ultrasound localization of implants is feasible with minimal receive channels.
- Accurate localization significantly enhances ultrasonic power transfer efficiency.
- The proposed framework and methods pave the way for robust wireless power for medical implants.
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