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Updated: Dec 29, 2025

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
A Winkelmann1,2, B M Jablon2,3, V S Tong3
1Academic Centre for Materials and Nanotechnology, AGH University of Science and Technology, Krakow, Poland.
High-precision orientation refinement using simulated pattern matching in electron backscatter diffraction (EBSD) offers superior accuracy for imaging microstructures. Postprocessing noisy EBSD data can reduce spatial resolution and introduce artifacts.
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