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Unconventional Application of Direct Ink Writing: Surface Force-Driven Patterning of Low Viscosity Inks
1Flexible Electronics and Sustainable Technologies (FEST) Lab, Department of Mechanical & Aerospace Engineering, West Virginia University, 1306 Evansdale Drive, Morgantown, West Virginia 26506, United States.
ACS Applied Materials & Interfaces
|March 17, 2020
Summary
A novel direct ink writing method uses capillary action for precise micropatterning of titanium dioxide. This surface force-driven technique allows tunable structure heights and reduced surface roughness for thin film applications.
Area of Science:
- Materials Science
- Nanotechnology
- Surface Chemistry
Background:
- Direct ink writing (DIW) typically requires applied pressure, limiting its use with low-viscosity inks.
- Micropatterning of functional materials like titanium dioxide is crucial for advanced thin film technologies.
Purpose of the Study:
- To investigate a new concept for pressure-free direct ink writing of low-viscosity titanium dioxide inks.
- To explore the control over printed structure dimensions and surface properties using this novel DIW method.
Main Methods:
- Characterization of titanium dioxide inks (rheological, thermal, surface properties).
- Surface force-driven DIW using diluted, low-viscosity inks.
- Analysis of printed structures using profilometry, AFM, and SEM.
- Evaluation of photocatalytic activity via methylene blue degradation.
Main Results:
- Achieved tunable structure heights from sub-100 nm to over 1 μm by controlling writing speed, ink composition, and substrate surface.
- Reduced surface roughness of titanium dioxide films by up to 60% through optimized writing parameters.
- Demonstrated a viable alternative to inkjet printing for low-viscosity solution micropatterning.
Conclusions:
- Surface force-driven DIW offers a new approach for precise micropatterning of low-viscosity inks.
- This method enables tailored thin film fabrication with controlled morphology and properties.
- The technique holds significant potential for various thin film technological applications.
