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The New Technologies Developed from Laser Shock Processing.

Jiajun Wu1,2,3, Jibin Zhao1,2, Hongchao Qiao1,2

  • 1Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang 110016, Liaoning, China.

Materials (Basel, Switzerland)
|March 27, 2020
PubMed
Summary
This summary is machine-generated.

Laser shock processing (LSP) enhances materials using stress waves. New technologies like LSF, WLSP, LSM, and LSI expand LSP applications by leveraging laser-generated stress effects for forming, hardening, marking, and imprinting.

Keywords:
laser shock forminglaser shock imprintinglaser shock markinglaser shock processingstress effectwarm laser shock processing

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Area of Science:

  • Materials Science and Engineering
  • Surface Engineering
  • Advanced Manufacturing Technologies

Background:

  • Laser shock processing (LSP) is a key technology for surface hardening of metallic materials.
  • It improves mechanical properties and extends service life via laser-induced plasma shock waves.
  • Modern industry demands continuous innovation, leading to new LSP-derived technologies.

Purpose of the Study:

  • To summarize the fundamental principles of LSP and laser-induced plasma shock waves.
  • To introduce and detail emerging technologies derived from LSP: LSF, WLSP, LSM, and LSI.
  • To highlight the common reliance on laser-generated stress effects over thermal effects.

Main Methods:

  • Review and synthesis of the technical theory behind LSP.
  • Detailed explanation of four new technologies: Laser Shock Forming (LSF), Warm Laser Shock Processing (WLSP), Laser Shock Marking (LSM), and Laser Shock Imprinting (LSI).
  • Emphasis on the stress-effect mechanism common to all discussed technologies.

Main Results:

  • LSF modifies metal sheet curvature using high dynamic loading.
  • WLSP enhances material strength and micro-structure stability compared to LSP.
  • LSM enables visualized surface marking through carefully prepared absorbing layers.
  • LSI achieves large-scale imprinting of 3D nanostructures on crystalline metals at high strain rates.

Conclusions:

  • LSP and its derived technologies offer significant advantages by utilizing laser-generated stress effects.
  • WLSP shows superior performance in material hardening and stability.
  • LSF, LSM, and LSI provide novel solutions for metal forming, marking, and nanostructure imprinting.
  • This work provides valuable insights for researchers exploring LSP and its advanced applications.