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Interfacial effects on leakage currents in Cu/α-cristobalite/Cu junctions
Kuan-Bo Lin1,2, Yen-Hsun Su3, Chao-Cheng Kaun4,5
1Research Center for Applied Sciences, Academia Sinica, Taipei, 11529, Taiwan.
Investigating quantum transport in integrated circuits reveals that oxygen-rich interfaces minimize leakage currents. However, oxygen-poor interfaces may offer superior dielectric strength due to their wider transmission gap.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Semiconductor Device Physics
Background:
- Miniaturization of integrated circuits increases leakage currents in dielectric films.
- Quantum transport at interconnect-dielectric interfaces is crucial but understudied.
- First-principles investigations are needed to understand interfacial effects on leakage.
Purpose of the Study:
- To investigate interfacial-dependent leakage currents in Cu/α-cristobalite/Cu junctions.
- To explore quantum transport phenomena at these critical interfaces.
- To determine the impact of interface composition on electrical properties.
Main Methods:
- First-principles calculations.
- Density functional theory (DFT).
- Non-equilibrium Green's function (NEGF) formalism.
Main Results:
- Oxygen-rich interfaces exhibit the lowest leakage currents under small bias.
- Silicon-rich and oxygen-poor interfaces show higher leakage.
- Oxygen-poor interfaces possess a wider transmission gap, suggesting potentially better dielectric strength.
Conclusions:
- Interface composition significantly influences leakage currents in dielectric films.
- Oxygen-rich interfaces are optimal for reducing leakage.
- Oxygen-poor interfaces may offer enhanced dielectric properties despite higher leakage.
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