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Direct integration of micro-LEDs and a SPAD detector on a silicon CMOS chip for data communications and
Optics Express
|April 1, 2020
Summary
This study demonstrates hybrid integration of micro-light emitting diodes (micro-LEDs) with CMOS chips for advanced optical communication and ranging. The system achieves 1 Mbps data rates and centimeter-scale time-of-flight resolution.
Area of Science:
- Optoelectronics
- Integrated Circuits
- Photonics
Background:
- Micro-light emitting diodes (micro-LEDs) offer potential for high-performance optical systems.
- Integration challenges have limited the widespread application of micro-LEDs in complex systems.
- Complementary Metal-Oxide-Semiconductor (CMOS) technology provides advanced driving and sensing capabilities.
Purpose of the Study:
- To demonstrate the direct integration of micro-LEDs onto a silicon CMOS drive chip.
- To develop a hybrid system capable of both optical communication and ranging.
- To evaluate the performance of the integrated micro-LED array and CMOS driver.
Main Methods:
- Utilized a transfer printing method for precise placement of singulated micron-sized light emitting diodes (micro-LEDs) onto a CMOS chip.
- Designed an 8x8 micro-LED device array with individual pixel control.
- Incorporated a Single Photon Avalanche Diode (SPAD) device within the CMOS driver for detection.
Main Results:
- Successfully integrated micro-LEDs onto a silicon CMOS drive chip.
- Demonstrated an 8x8 micro-LED array with modulation bandwidths up to 50 MHz.
- Achieved visible light communication data rates up to 1 Mbps.
- Showcased time-of-flight ranging with centimeter-scale resolution using the hybrid integrated system.
Conclusions:
- The hybrid integration of micro-LEDs and CMOS chips enables multifunctional optical systems on a single chip.
- This approach overcomes previous integration limitations, paving the way for advanced optoelectronic devices.
- The demonstrated system holds promise for applications in optical communications and high-resolution sensing.

