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Crosstalk Analysis of a CMOS Single Membrane Thermopile Detector Array.
Ying Dai1, Syed Zeeshan Ali2, Richard Hopper1
1Department of Engineering, University of Cambridge, Cambridge CB3 0FA, UK.
Sensors (Basel, Switzerland)
|May 6, 2020
Summary
A new bi-directional electrical heating method simplifies crosstalk characterization for thermopile thermal imagers. This technique offers a more reliable approach for understanding thermal effects in emerging imaging applications.
Area of Science:
- Thermal imaging
- Sensor characterization
- Microbolometer technology
Background:
- Thermopile-based thermal imagers are crucial for industrial and consumer applications.
- Accurate characterization of crosstalk is essential for reliable thermal imaging performance.
- Existing crosstalk measurement techniques can be complex and less reliable.
Discussion:
- A novel bi-directional electrical heating technique is introduced for thermopile crosstalk characterization.
- This method simplifies the experimental setup compared to laser-based approaches.
- The technique is applied to a novel single-chip thermopile array on a dielectric membrane.
Key Insights:
- The new technique provides a simpler and more reliable way to determine thermopile crosstalk.
- A theoretical model for crosstalk simulation shows good agreement with experimental data.
- Understanding thermal effects is improved, crucial for device optimization.
Outlook:
- The developed technique facilitates better thermal effect understanding in thermopile devices.
- This research supports the advancement of thermopile imagers in growing markets.
- Further optimization of single-chip arrays can be achieved through this characterization method.
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