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Updated: Dec 21, 2025

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Optical Thermometry with Quantum Emitters in Hexagonal Boron Nitride.

Yongliang Chen1, Thinh Ngoc Tran1, Ngoc My Hanh Duong1

  • 1School of Mathematical and Physical Sciences, University of Technology Sydney, Ultimo, NSW 2007, Australia.

ACS Applied Materials & Interfaces
|May 13, 2020
PubMed
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This summary is machine-generated.

Quantum emitters in hexagonal boron nitride offer advanced nanoscale optical thermometry. This technique surpasses existing methods in sensitivity and temperature range for microelectronic devices.

Area of Science:

  • Quantum physics
  • Materials science
  • Nanotechnology

Background:

  • Nanoscale optical thermometry enables precise, noncontact temperature measurements.
  • Existing methods face limitations in sensitivity and operational temperature range.

Purpose of the Study:

  • To develop and demonstrate a deterministic optical thermometry technique using quantum emitters in hexagonal boron nitride (hBN).
  • To evaluate the performance of hBN-based nanothermometers compared to existing technologies.

Main Methods:

  • Utilizing quantum emitters within nanoscale hexagonal boron nitride as temperature sensors.
  • Deterministic placement and characterization of these quantum emitters.
  • Testing nanothermometers in custom-built microcircuits to monitor local temperatures.
Keywords:
deterministic positioninghexagonal boron nitridemicrocircuitsoptical thermometryquantum emittertemperature sensing

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Main Results:

  • Demonstrated superior performance of hBN nanothermometers over homologous, all-optical nanothermometers.
  • Achieved enhanced sensitivity and a wider working temperature range.
  • Successfully monitored local temperatures in various microcircuit configurations.

Conclusions:

  • Hexagonal boron nitride quantum emitters provide a highly effective platform for nanoscale optical thermometry.
  • This technique offers significant advancements for temperature measurements and heat flow studies in miniaturized electronic devices.
  • Opens new possibilities for integrated thermal management and device characterization.