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Adjustable panoramic inspection system for submillimeter fasteners.

Yung-Jhe Yan, Ming-Shiou Tsai, Wen-Bin Chen

    Applied Optics
    |May 14, 2020
    PubMed
    Summary
    This summary is machine-generated.

    This study introduces an adjustable panoramic inspection system for submillimeter fasteners (M0.8 to M2.0). The system enables rapid, high-contrast imaging for efficient quality control in electronic device assembly.

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    Area of Science:

    • Mechanical Engineering
    • Optical Systems
    • Quality Control

    Background:

    • Submillimeter fasteners are essential components in modern electronic devices.
    • Accurate and efficient inspection of these small fasteners is critical for product reliability.
    • Existing inspection methods may lack the speed or precision required for mass production.

    Purpose of the Study:

    • To develop an adjustable panoramic inspection system for submillimeter fasteners (M0.8 to M2.0).
    • To enhance the speed and accuracy of fastener quality control in electronic manufacturing.
    • To provide a versatile solution for inspecting fasteners of varying sizes.

    Main Methods:

    • Designed a system comprising a panoramic imaging module, back-light module, and image grabbing/computing module.
    • The panoramic imaging module ensures consistent magnification across the field of view.
    • A uniform back-light module enhances fastener edge contrast for improved recognition.
    • An adjustable high-speed camera system accommodates different fastener sizes.

    Main Results:

    • The system captures four images in a single shot, creating a panoramic view.
    • Achieved rapid image processing times: 3.284 ms for M0.8 screws and 2.384 ms for M2.0 screws.
    • Demonstrated the capability to inspect up to 6000 fasteners per minute.

    Conclusions:

    • The proposed adjustable panoramic inspection system effectively inspects submillimeter fasteners (M0.8-M2.0).
    • The system offers significant improvements in inspection speed and efficiency for electronic assembly.
    • This technology facilitates high-throughput quality control for miniature mechanical components.